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HSMx-A10x-xxxxx PLCC-2
Surface Mount LED Indicator
Data Sheet
Description
This family of SMT LEDs is packaged in the industry standard PLCC-2 package. These SMT LEDs have high reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under harsh interior automotive as well as interior signs application conditions. To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin, except red color, to provide close uniformity. These LEDs are compatible with IR solder reflow process. Due to the high reliability feature of these products, they can also be mounted using through-the-wave soldering process. The super wide viewing angle at 120 makes these LEDs ideally suited for panel, push button, or general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. With the built-in reflector pushing up the intensity of the light output, these LEDs are also suitable to be used as LED pixels in interior electronic signs.
Features
* Industry standard PLCC-2 package * High reliability LED package * High brightness using AlInGaP and InGaN dice technologies * Available in full selection of colors * Super wide viewing angle at 120 * Available in 8 mm carrier tape on 7 inch reel (2000 pieces) * Compatible with both IR and TTW soldering process
Applications
* Interior automotive - Instrument panel backlighting - Central console backlighting - Cabin backlighting * Electronic signs and signals - Interior full color sign - Variable message sign * Office automation, home appliances, industrial equipment - Front panel backlighting - Push button backlighting - Display backlighting
CAUTION: HSMN,M,K and E-A10x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Dimensions
2.8 0.2 2.2 0.2 0.1 TYP.
1.9 0.2 0.8 0.1
3.2 0.2
3.5 0.2
0.8 0.3
CATHODE MARKING (ANODE MARKING FOR AlGaAs DEVICES)
0.5 0.1
TOP MOUNT
2.8 0.2 2.2 0.2 1.9 0.2
3.2 0.2
5.2 0.2
0.1 TYP.
CATHODE MARKING
0.5 0.1
REVERSE MOUNT
NOTE: ALL DIMENSIONS IN MILLIMETERS.
2
Device Selection Guide Red Part Number HSMS-A100-J00J1 HSMS-A100-L00J1 HSMS-A100-H70J2 HSMS-A100-J80J2 HSMH-A100-L00J1 HSMH-A100-N00J1 HSMH-A100-L70J2 HSMH-A100-M80J2 HSMH-A100-P0J1 HSMC-A100-J00J1 HSMC-A100-Q00J1 HSMC-A100-R00J1 HSMC-A101-S00J1 HSMZ-A100-T00J1 HSMC-A100-P0J1 HSMC-A101-R80J1 HSMZ-A100-S80J1 Red Orange Part Number HSMJ-A100-Q00J1 HSMJ-A101-S00J1 HSMV-A100-T00J1 HSMJ-A100-Q0J1 HSMJ-A100-R40J1 HSMJ-A101-R80J1 HSMV-A100-S80J1 Orange Part Number HSMD-A100-J00J1 HSMD-A100-L00J1 HSMD-A100-J7PJ2 HSMD-A100-K4PJ2 HSML-A100-Q00J1 HSML-A101-S00J1 HSML-A100-Q7PJ1 HSML-A100-R7PJ1 HSML-A101-R8WJ1 Min. Iv (mcd) 4.0 10.0 5.0 6. 6.0 160.0 80.0 125.0 125.0 Typ. Iv (mcd) 15.0 15.0 100.0 220.0 Max. Iv (mcd) 12.5 20.0 200.0 15.0 95.0 Test Current (mA) 20 20 10 10 20 20 20 20 20 Dice Technology GaP GaP GaP GaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP Min. Iv (mcd) 6.0 160.0 250.0 6.0 100.0 125.0 200.0 Typ. Iv (mcd) 100.0 200.0 50.0 Max. Iv (mcd) 155.0 15.0 95.0 620.0 Test Current (mA) 20 20 20 20 20 20 20 Dice Technology AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP Min. Iv (mcd) 4.0 10.0 .0 5.0 10.0 25.0 12.5 20.0 40.0 4.0 6.0 100.0 160.0 250.0 40.0 125.0 200.0 Typ. Iv (mcd) 15.0 15.0 15.0 50.0 100.0 100.0 140.0 220.0 50.0 Max. Iv (mcd) 8.0 15.5 2.0 62.0 100.0 100.0 95.0 620.0 Test Current (mA) 20 20 10 10 20 20 10 10 20 20 20 20 20 20 20 20 20 Dice Technology GaP GaP GaP GaP AlGaAs AlGaAs AlGaAs AlGaAs AlGaAs AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP
Device Selection Guide, continued Yellow/Amber Part Number HSMY-A100-J00J1 HSMY-A100-L00J1 HSMY-A100-J5J2 HSMY-A100-K45J2 HSMA-A100-Q00J1 HSMA-A101-S00J1 HSMU-A100-S00J1 HSMA-A100-Q5J1 HSMA-A100-R45J1 HSMA-A101-R8WJ1 HSMU-A100-S4WJ1 Yellow Green Part Number HSMG-A100-J02J1 HSMG-A100-K72J2 HSME-A100-M02J1 HSME-A100-N82J1 Emerald Green Part Number HSMG-A100-H01J1 HSMG-A100-G1J2 HSMG-A100-H41J2 HSME-A100-L01J1 HSME-A100-MPJ1 Green Part Number HSMM-A101-R00J1 HSMM-A100-S00J1 HSMM-A101-Q7PJ1 HSMM-A101-R7PJ1 HSMM-A101-R8PJ1 HSMM-A100-S8PJ1 Min. Iv (mcd) 2.5 1.6 2.5 10.0 16.0 Typ. Iv (mcd) 8.0 40.0 Max. Iv (mcd) 4.0 8.0 40.0 Test Current (mA) 20 10 10 20 20 Dice Technology GaP GaP GaP AlInGaP AlInGaP Min. Iv (mcd) 4.0 8.0 16.0 0.0 Typ. Iv (mcd) 18.0 70.0 Max. Iv (mcd) 20.0 100.0 Test Current (mA) 20 10 20 20 Dice Technology GaP GaP AlInGaP AlInGaP Min. Iv (mcd) 4.0 10.0 4.0 6. 6.0 160.0 160.0 6.0 100.0 125.0 160.0 Typ. Iv (mcd) 12.0 12.0 100.0 220.0 20.0 Max. Iv (mcd) 10.0 20.0 155.0 15.0 95.0 500.0 Test Current (mA) 20 20 10 10 20 20 20 20 20 20 20 Dice Technology GaP GaP GaP GaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP AlInGaP
Min. Iv (mcd) 100.0 160.0 80.0 125.0 125.0 200.0
Typ. Iv (mcd) 200.0 50.0 -
Max. Iv (mcd) 200.0 15.0 95.0 620.0
Test Current (mA) 20 20 20 20 20 20
Dice Technology InGaN InGaN InGaN InGaN InGaN InGaN
4
Device Selection Guide, continued Cyan Part Number HSMK-A101-R00J1 HSMK-A100-S00J1 HSMK-A100-S8WJ1 HSMK-A101-QWJ1 HSMK-A101-R4WJ1 Blue Part Number HSMB-A100-J00J1 HSMB-A100-J70J2 HSMB-A100-K80J2 HSMN-A101-N00J1 HSMN-A100-P00J1 HSMN-A101-N7YJ1 HSMN-A100-P8YJ1 Min. Iv (mcd) 4.0 5.0 8.0 25.0 40.0 0.0 50.0 Typ. Iv (mcd) 15.0 50.0 70.0 Max. Iv (mcd) 12.5 25.0 80.0 155.0 Test Current (mA) 20 10 10 20 20 20 20 Dice Technology GaN GaN GaN InGaN InGaN InGaN InGaN Min. Iv (mcd) 100.0 160.0 200.0 6.0 100.0 Typ. Iv (mcd) 170.0 280.0 Max. Iv (mcd) 620.0 155.0 15.0 Test Current (mA) 20 20 20 20 20 Dice Technology InGaN InGaN InGaN InGaN InGaN
Note: 1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis.
5
Part Numbering System HSM x 1 - A x 2 x x 4 - x 5 x 6 x 7 x 8 x 9 Packaging Option Color Bin Selection Intensity Bin Select Device Specific Configuration Package Type LED Chip Color
Absolute Maximum Ratings (TA = 25C) Parameters DC Forward Current[1] Peak Forward Current[2] Power Dissipation Reverse Voltage Junction Temperature Operating Temperature Storage Temperature HSMS/D/Y/G 0 mA 100 mA 6 mW HSMH 0 mA 100 mA 60 mW HSMC/J/L/A 0 mA[,4] 100 mA 6 mW 5V 110C -55C to +100C -55C to +100C HSME 20 mA[4] 100 mA 48 mW HSMZ/V/U 0 mA[,4] 100 mA 72 mW HSMM/K/B/N 0 mA 100 mA 114 mW
Notes: 1. Derate linearly as shown in Figure 4. 2. Duty factor = 10%, Frequency = 1 kHz. . Drive current between 10 mA and 0 mA is recommended for best long term performance. 4. Operation at current below 5 mA is not recommended.
6
Optical Characteristics (TA = 25C) Peak Wavelength PEAK (nm) Typ. 65 645 65 69 621 62 600 609 58 592 594 565 575 558 566 52 502 428 468 Dominant Wavelength[1] D (nm) Typ. 626 67 626 60 615 617 602 605 585 590 592 569 570 560 560 525 505 462 470 Viewing Angle 2 1/2[2] (Degrees) Typ. 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 120 Luminous Efficacy v[3] (lm/W) Typ. 120 6 150 155 240 26 80 20 520 480 500 590 560 650 610 500 00 65 75 Luminous Intensity/ Total Flux Iv(mcd)/v(mlm) Typ. 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45 0.45
Color Red
Part Number HSMS-A100 HSMH-A100 HSMC-A10x HSMZ-A100
Dice Technology GaP AlGaAs AlInGaP AlInGaP AlInGaP AlInGaP GaP AlInGaP GaP AlInGaP AlInGaP GaP AlInGaP GaP AlInGaP InGaN InGaN GaN InGaN
Red Orange Orange Amber
HSMJ-A10x HSMV-A100 HSMD-A100 HSML-A10x HSMY-A100 HSMA-A10x HSMU-A100
Yellow Green Emerald Green Green Cyan Blue
HSMG-A100 HSME-A100 HSMG-A100 HSME-A100 HSMM-A10x HSMK-A10x HSMB-A100 HSMN-A10x
Notes: 1. The dominant wavelength, D, is derived from the CIE Chromaticity Diagram and represents the color of the device. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. . Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt.
Electrical Characteristics (TA = 25C) Forward Voltage Reverse Voltage Reverse Voltage VF (Volts) @ IF = 20 mA VR @ 100 A Typ. Max. Min. 2.2 1.9 1.9 2.2 .9 .4 2.6 2.6 2.4 2.6 4. 4.05 5 5 5 5 -- -- Thermal VR @ 10 A Min. -- -- -- -- 5 5 Resistance RJP (C/W) 180 180 280 280 280 280
Part Number HSMS/D/Y/G HSMH HSMC/J/L/A/E HSMZ/V/U HSMB HSMM/K/N
7
35
FORWARD CURRENT - mA
30 25 20
HSMS/D/Y/G HSMZ/V/U
HSMH
15 10 5 0
HSMC/J/L/A/E
HSMM/K/N
HSMB
0
1
2
3
4
5
FORWARD VOLTAGE - V
Figure 2. Forward current vs. forward voltage.
Figure 1. Relative intensity vs. wavelength.
Figure 3. Relative intensity vs. forward current.
35 30 25 20 15 10 5 0
HSMS/D/G/ Y/H/Z/V/U
35
540 DOMINANT WAVELENGTH - nm 530 520 510 500 490 480 470 460
0 20 40 60 80 TEMPERATURE (C) 100 120
30 25 20 15 10 5 0
HSMS/D/G/Y/H HSMC/J/L/A HSMZ/V/U HSME HSMM/K/N HSMB
GREEN
CURRENT - mA
HSMC/J/L/A HSME HSMM/K/B/N
CURRENT - mA
CYAN
BLUE 0 5 10 15 20 25 30 35
0
20
40 60 80 100 TEMPERATURE (C)
120
CURRENT - mA
Figure 4. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 110C, RJA = 500C/W.
Figure 4b. Maximum Forward Current Vs. Solder Point Temperature. Derated based on TJMAX = 110C, RJP = 180C/W or 280C/W.
Figure 5. Dominant wavelength vs. forward current - InGaN devices.
HSMx-A100 fig 5
8
0.5
DELTA VF (NORMALIZED AT 25C)
0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -100 -50 InGaN/GaN 0 50 100 150 GaP/AlGaAs/ AlInGaP
TEMPERATURE - C
Figure 6. Forward voltage shift vs. temperature.
Figure 7. Radiation Pattern.
10 to 30 SEC.
TEMPERATURE
217 C 200 C 150 C
255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX.
TIME (Acc. to J-STD-020C)
Figure 8a. Recommended SnPb reflow soldering profile.
Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components.
Figure 8b. Recommended Pb-free reflow soldering profile.
4.50 1.50
TURBULENT WAVE
250
TEMPERATURE - C
LAMINAR WAVE HOT AIR KNIFE
2.60
200 150
FLUXING
100 50 30 0 10
BOTTOM SIDE OF PC BOARD PREHEAT TOP SIDE OF PC BOARD
20
30
40
50
60
70
80
90
100
TIME - SECONDS
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 LEADED SOLDER: SN63; FLUX: RMA LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE.
SOLDER RESIST
Figure 9. Recommended wave soldering profile.
Figure 10. Recommended soldering pad pattern.
9
Figure 11. Tape leader and trailer dimensions.
Figure 12. Tape dimensions.
10
Figure 13. Reel dimensions.
Figure 14. Reeling orientation.
11
Intensity Bin Select (X5X6) Individual reel will contain parts from one half bin only. X5 Min Iv Bin X6 0 4 5 7 8 9
Full Distribution half bins starting from X51 4 half bins starting from X51 5 half bins starting from X51 half bins starting from X52 4 half bins starting from X52 5 half bins starting from X52
Intensity Bin Limits Bin ID Min. (mcd) G1 1.80 G2 2.24 H1 2.80 H2 .55 J1 4.50 J2 5.60 K1 7.20 K2 9.00 L1 11.20 L2 14.00 M1 18.00 M2 22.40 N1 28.50 N2 5.50 P1 45.00 P2 56.00 Q1 71.50 Q2 90.00 R1 112.50 R2 140.00 S1 180.00 S2 224.00 T1 285.00 T2 55.00 U1 450.00 U2 560.00 V1 715.00 V2 900.00 12
Max. (mcd) 2.24 2.80 .55 4.50 5.60 7.20 9.00 11.20 14.00 18.00 22.40 28.50 5.50 45.00 56.00 71.50 90.00 112.50 140.00 180.00 224.00 285.00 55.00 450.00 560.00 715.00 900.00 1125.00
Color Bin Select (X7) Individual reel will contain parts from one full bin only. X7 0 Full Distribution Z A and B only Y B and C only W C and D only V D and E only U E and F only T F and G only S G and H only Q A, B, and C only P B, C, and D only N C, D, and E only M D, E, and F only L E, F, and G only K F, G, and H only 1 A, B, C, and D only 2 E, F, G, and H only B, C, D, and E only 4 C, D, E, and F only 5 A, B, C, D, and E only 6 B, C, D, E, and F only Color Bin Limits Blue Min. (nm) A 460.0 B 465.0 C 470.0 D 475.0 Cyan A B C D Min. (nm) 490.0 495.0 500.0 505.0
Color Bin Limits Emerald Green Min. (nm) A 552.5 B 555.5 C 558.5 D 561.5 Yellow Green E F G H
Max. (nm) 555.5 558.5 561.5 564.5
Min. (nm) 564.5 567.5 570.5 57.5
Max. (nm) 567.5 570.5 57.5 576.5
Amber A B C D E F Orange A B C D E Red Orange A B
Min. (nm) 582.0 584.5 587.0 589.5 592.0 594.5 Min. (nm) 597.0 600.0 60.0 606.0 609.0 Min. (nm) 611.0 616.0
Max. (nm) 584.5 587.0 589.5 592.0 594.5 597.0 Max. (nm) 600.0 60.0 606.0 609.0 612.0 Max. (nm) 616.0 620.0
Max. (nm) 465.0 470.0 475.0 480.0 Max. (nm) 495.0 500.0 505.0 510.0
Red Min. (nm) Full Distribution
Max. (nm)
Tolerance of each bin limit = 1 nm.
Green A B C D
Min. (nm) 515.0 520.0 525.0 50.0
Max. (nm) 520.0 525.0 50.0 55.0
Tolerance of each bin limit = 12%.
Packaging Option (X8X9) Option Test Current J1 20 mA J4 20 mA H1 20 mA H4 20 mA J2 10 mA J5 10 mA H2 10 mA H5 10 mA
Moisture Sensitivity
Package Type Top Mount Top Mount Reverse Mount Reverse Mount Top Mount Top Mount Reverse Mount Reverse Mount Reel Size 7 inch 1 inch 7 inch 1 inch 7 inch 1 inch 7 inch 1 inch This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN505 Handling of Moisture Sensitive Surface Mount Devices for details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <0C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours.
E. Baking is required if:
- "10%" or "15%" HIC indicator turns pink. - The LEDs are exposed to condition of >0C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 605C for 20 hours.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0040EN AV02-0198EN - May 30, 2007

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